SYSILICON.SYSILICON was established in 2004 and is located in Shenyang, Liaoning Province, China, occupying an area of 40,000 square meters. With a registered capital of 460 million RMB, the company possesses advanced SOI patented technology and manufacturing lines. As a high-tech enterprise dedicated to the R&D, production, and sales of SOI wafers, it is also a domestic SOI material supplier with proprietary intellectual property rights—the “low-temperature microwave” thin-film transfer technology. Primary products include 8-inch thin-film SOI, 8-inch epitaxial SOI, 6-8-inch thick-film SOI, 6-8-inch silicon-on-silicon bonded wafers, 6-8-inch patterned SOI, 8-inch ultra-thin-film SOI, and 8-inch epitaxial wafers. The company operates over 90 sets of state-of-the-art production and testing equipment, achieving an annual production capacity exceeding 200,000 wafers. It supplies cost-effective, high-quality SOI materials to integrated circuit manufacturers and foundries worldwide. The company holds ISO9001:2015, IATF16949:2016, ISO14001:2015, and OHSAS18001:2007 certifications. SOI materials find extensive applications in high-end devices, RF components, MEMS sensors, computer products, micro-electromechanical systems, gyroscopes, silicon microphones, sensors, optical communications, and numerous other fields. The nation has consistently prioritized chip manufacturing based on SOI materials. As domestic applications of SOI materials continue to diversify and the number of SOI industry chain participants grows, SOI materials will gradually enter a mature phase within China's semiconductor sector. This development will facilitate the formation of a domestic industry chain and further promote the advancement of SOI materials. Primary products include: SOI wafers, epitaxial wafers, silicon-on-silicon bonded wafers, and thinned wafers.
